Printed Circuit Board Manufacturing
Printed Circuit Board (PCB) manufacturing is a complex and essential process in the electronics industry. PCBs provide the foundation for virtually all electronic devices by mechanically supporting components and creating the electrical connections needed for reliable operation.
Printed Circuit Board Manufacturing Service: Printed circuit boards range from simple single- and double-sided designs to sophisticated multilayer boards. Our goal is to provide high-quality PCB products that meet your technical requirements while offering a cost-effective manufacturing solution.
We provide comprehensive printed circuit board fabrication, assembly, and component sourcing services for customers across a wide range of industries. Our team works closely with engineers, purchasing teams, OEMs, and contract manufacturers to ensure each PCB meets the required specifications for performance, reliability, quality, and production volume.
Printed circuit boards may not always be the most expensive components in an electronic product, but they are among the most important. The performance and reliability of the finished product depend heavily on the quality and capabilities of the circuit board. Selecting the right PCB manufacturer can therefore have a direct impact on product quality, production efficiency, and overall cost.
Our PCB manufacturing capabilities support high-mix, low- and medium-volume production, as well as more demanding multilayer applications. We focus on quality, responsive service, competitive pricing, and reliable delivery to help customers meet their production schedules.
A printed circuit board mechanically supports and electrically connects electronic components using conductive copper tracks, pads, vias, and other features laminated onto an insulating substrate.
| PCB Technical Specifications | |||||||
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Seq |
Item |
Technical Specification |
Remarks |
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Standard |
Advanced |
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1 |
Number of Layers |
1-10 Layers |
12-16 Layers |
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2 |
Base Material |
FR4 (High TG), Teflon, Rogers, Aluminum Based |
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3 |
Finished Board Thickness |
0.30 mm ~ 3.20 mm |
0.20 mm ~ 4.5 mm |
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4 |
Minimum Core Thickness |
0.15 mm (6 mil) |
0.10 mm (4 mil) |
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5 |
Copper Thickness |
Min. 1/2 OZ, Max. 4 OZ |
Min. 1/3 OZ, Max. 6 OZ |
Selective areas available; thicker copper available upon request |
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6 |
Min. Trace Width & Line Space |
Single Sided |
0.13 mm (5 mil) |
0.10 mm (4 mil) |
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Double Sided |
0.13 mm (5 mil) |
0.10 mm (4 mil) |
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7 |
Min. Hole Diameter |
Drilling / PTH |
0.20 mm (8 mil) |
0.20 mm (8 mil) |
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Punching |
1.0 mm (40 mil) |
0.90 mm (36 mil) |
If necessary |
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8 |
Dimension Tolerance |
Hole Position |
0.08 mm (3 mil) |
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Conductor Width (W) |
20% Deviation of Master A/W |
1 mil Deviation of Master A/W |
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Hole Diameter (H) |
NPTH: +/-0.05 mm (2 mil) |
NPTH: +/-0.05 mm (2 mil) |
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PTH: +/-0.075 mm (3 mil) |
PTH: +/-0.05 mm (2 mil) |
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Outline Dimension |
0.13 mm (5 mil) |
0.10 mm (4 mil) |
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Conductors & Outline (C-O) |
0.15 mm (6 mil) |
0.13 mm (5 mil) |
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Warp and Twist |
0.75% |
0.50% |
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9 |
Surface Treatment on Land Area |
Lead-Free HASL, Entek, Immersion Silver, Immersion Tin, Gold Finger, OSP |
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10 |
V-Cutting |
Panel Size |
457.2 mm X 622 mm max. |
457.2 mm X 800 mm max. |
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Board Thickness |
0.50 mm (20 mil) min. |
0.30 mm (12 mil) min. |
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Remain Thickness |
1/3 board thickness |
0.40 +/-0.10 mm (16 +/-4 mil) |
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Tolerance |
±0.13 mm (5 mil) |
±0.1 mm (4 mil) |
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Groove Width |
0.50 mm (20 mil) max. |
0.38 mm (15 mil) max. |
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Groove to Groove |
20 mm (787 mil) min. |
10 mm (394 mil) min. |
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Groove to Trace |
0.45 mm (18 mil) min. |
0.38 mm (15 mil) min. |
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11 |
Slot |
Slot Size Tolerance |
PTH Slot: L +/-0.13 mm (5 mil), W +/-0.08 mm (3 mil) |
PTH Slot: L +/-0.10 mm (4 mil), W +/-0.05 mm (2 mil) |
L = slot length; W = slot width. Minimum drill bit size for multi-hit is 0.60 mm. |
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NPTH Slot: L +/-0.10 mm (4 mil), W +/-0.05 mm (2 mil) |
NPTH Slot: L +/-0.08 mm (3 mil), W +/-0.05 mm (2 mil) |
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12 |
Min. Spacing from Hole Edge to Hole Edge |
0.30-1.60 Hole Diameter |
0.15 mm (6 mil) |
0.10 mm (4 mil) |
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1.61-6.50 Hole Diameter |
0.15 mm (6 mil) |
0.13 mm (5 mil) |
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13 |
Minimum Spacing Between Hole Edge and Circuitry Pattern |
PTH Hole: 0.20 mm (8 mil) |
PTH Hole: 0.13 mm (5 mil) |
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NPTH Hole: 0.18 mm (7 mil) |
NPTH Hole: 0.10 mm (4 mil) |
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14 |
Image Transfer Registration Tolerance |
Circuit Pattern vs. Index Hole |
0.10 mm (4 mil) |
0.08 mm (3 mil) |
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Circuit Pattern vs. 2nd Drill Hole |
0.15 mm (6 mil) |
0.10 mm (4 mil) |
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15 |
Front/Back Image Registration Tolerance |
0.075 mm (3 mil) |
0.05 mm (2 mil) |
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16 |
Multilayers |
Layer-to-Layer Misregistration |
4 layers: |
0.15 mm (6 mil) max. |
4 layers: |
0.10 mm (4 mil) max. |
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| 6 layers: |
0.20 mm (8 mil) max. |
6 layers: |
0.13 mm (5 mil) max. |
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| 8 layers: |
0.25 mm (10 mil) max. |
8 layers: |
0.15 mm (6 mil) max. |
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Min. Spacing from Hole Edge to Innerlayer Pattern |
0.225 mm (9 mil) |
0.15 mm (6 mil) |
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Min. Spacing from Outline to Innerlayer Pattern |
0.38 mm (15 mil) |
0.225 mm (9 mil) |
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Min. Board Thickness |
4 layers: 0.30 mm (12 mil) |
4 layers: 0.20 mm (8 mil) |
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6 layers: 0.60 mm (24 mil) |
6 layers: 0.50 mm (20 mil) |
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8 layers: 1.0 mm (40 mil) |
8 layers: 0.75 mm (30 mil) |
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Board Thickness Tolerance |
4 layers: +/-0.13 mm (5 mil) |
4 layers: +/-0.10 mm (4 mil) |
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6 layers: +/-0.15 mm (6 mil) |
6 layers: +/-0.13 mm (5 mil) |
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8-12 layers: +/-0.20 mm (8 mil) |
8-12 layers: +/-0.15 mm (6 mil) |
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17 |
Insulation Resistance |
10KΩ~20MΩ (typical: 5MΩ) |
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18 |
Conductivity |
<50Ω (typical: 25Ω) |
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19 |
Test Voltage |
250V |
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20 |
Impedance Control |
Typical: 50Ω +/-10% |
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Turnkey PCB Manufacturing & Assembly
PCB Assembly
- Single-sided PCB assembly and double-sided PCB assembly using boards ranging from 2 to 20+ layers.
- Support for complex, high-technology, multilayer PCB projects.
- Rigid and flexible PCB assemblies.
- Custom cable harnesses and wiring for complete product assemblies.
- Integrated sourcing and manufacturing support for complete PCB assembly requirements.
PCB Materials and Finishes
- FR4 in a variety of laminate configurations and temperature ratings.
- CEM-1 composite materials featuring woven glass fabric surfaces, paper core, and epoxy resin.
- Lead and lead-free material options based on application and production requirements.
- HASL (Hot Air Solder Leveling) for many standard PCB applications.
- ENIG (Electroless Nickel Immersion Gold) and Immersion Silver for applications requiring finer-pitch or BGA component technology.
PCB Documentation Required for Accurate Quoting
To provide an accurate quotation and determine the appropriate manufacturing process, we recommend supplying the following documentation:
- A BOM (Bill of Materials) with reference designators, component descriptions, manufacturer names, and part numbers.
- PCB Gerber files.
- PCB fabrication drawings and PCBA assembly drawings.
- Test procedures and inspection requirements.
- Mechanical restrictions, including component height and enclosure requirements.
We perform thorough inspection and testing to help ensure the functionality and reliability of manufactured circuit boards. Available testing methods can include automated optical inspection (AOI), flying probe testing, and in-circuit testing (ICT), depending on the requirements of the project. These processes help identify manufacturing defects, open circuits, short circuits, component placement issues, and other potential problems.
Additional Solutions: