Zymet X2852C Underfill Encapsulant

Zymet underfill encapsulant suitable for wafer-level packaging and BGA packaging. It can be cured quickly at low temperature and has fast fluidity. This encapsulant has excellent adhesion to organic substrates.

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SKU: X2852C Category: Thermal Management Brand: Zymet

Description

Description

Zymet X2852C is a reworkable underfill encapsulant that is capable of enhancing the board level reliability of WL-
CSP’s, FO-WLP’s, CSP’s, and BGA’s. It flows rapidly and cures quickly at low temperature. This encapsulant
exhibits excellent adhesion to organic substrates